2013287-3 datasheet

Маркировка

2013287-3
Производитель

TE Connectivity
Описание

TE Connectivity 2013287-3 Application Type: DDR 3 SO-DIMM Boss: With Center Key (mm [in]): Offset Right Centerline (mm [in]): 0.60 [0.024] Contact Base Material: Copper Alloy Contact Plating, Mating Area, Material: Gold (30) Dram Type: Double Data Rate (DDR) III Dram Voltage: 1.5 V Ejector Location: Both Ends Ejector Type: Locking Housing Color: Black Housing Material: High Temperature Thermoplastic Insertion Style: Cam-In Keying: Reverse Latch Material: Stainless Steel Latch Plating: Tin Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Module Orientation: Right Angle Number Of Keys: 1 Number Of Positions: 204 Number Of Rows: Dual Packaging Method: Semi-Hard Tray Assembly Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 8.20 [0.322] Socket Style: SO DIMM Socket Type: Memory Card Stack Height (mm [in]): 4.00 [0.157]
Количество страниц

6 шт.
Формат

PDF
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Размер файла

531,98 KB